Multi-stud thermal conduction module

Details Multi-stud thermal conduction module Multi-stud thermal conduction module

1979-12-17

1980-11-25

Richter, Sheldon

Heat exchange

With retainer for removable article

Including liquid heat exchange medium

165185, 357 81, 361386, H01L 2342

Patent

active

042352835

ABSTRACT:
The thermal conduction module for removing heat from one or more chips located therein consists of a housing made of heat conductive materials forming a cap over the chips. The housing contains one or more openings, one opposite each of the chips. More than one heat conductive element is included in each of the openings and are free to move lengthwise within the opening. The heat conductive elements are spring loaded so that the end of each element contacts the associated chip thereby lowering the thermal resistance of the interface therebetween. Side spring means are located between the sides of adjacent heat conductive elements forcing them away from one another and into contact with the opening wall.

REFERENCES:
patent: 3744560 (1973-07-01), Sell, Jr.
patent: 3993123 (1976-11-01), Chu et al.
patent: 4156458 (1979-05-01), Chu et al.
patent: 4184539 (1980-01-01), Rein
patent: 4193445 (1980-03-01), Chu et al.
Chip Cooling, Krumm, IBM Tech. Disc. Bull., vol. 20, No. 7, Dec. 1977, pp. 2728-2729.
Articulated Thermal Conductor For Semiconductor Chip Packages, Gregor et al., IBM Tech. Disc. Bull., vol. 20, No. 8, Jan. 1978, pp. 3131-3132.
Conduction Cooling, Chu, IBM Tech. Disc. Bull., vol. 21, No. 2, Jul. 1978, pp. 751, 752-753.

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