Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2008-07-08
2008-07-08
Dinh, Tuan T (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S261000, C174S521000, C361S805000
Reexamination Certificate
active
11676810
ABSTRACT:
A multi-strand printed circuit board substrate for ball-grid array (BGA) assemblies includes a printed wiring board (11) having a plurality of BGA substrates (12) arranged in N rows (14) and M columns (16) to form an N by M array. N and M are greater than or equal to 2 and the size of the N by M array is selected such that each of the plurality of BGA substrates (12) maintains a planarity variation less than approximately 0.15 mm (approximately 6 mils). The printed wiring board (11) has a thickness (26) sufficient to minimize planarity variation and to allow a manufacturer to use automated assembly equipment without having to use support pallets or trays.
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Dinh Tuan T
Freescale Semiconductor Inc.
Goodard Patricia
Singh Ranjeev
LandOfFree
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