Multi-step polishing solution for chemical mechanical...

Abrading – Abrading process – Glass or stone abrading

Reexamination Certificate

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Details

C451S036000, C451S054000, C451S065000, C051S308000, C051S309000, C438S692000, C438S693000, C252S079100

Reexamination Certificate

active

06971945

ABSTRACT:
The present invention provides a multi-step aqueous composition useful for polishing a tantalum barrier material and copper from a semiconductor wafer, comprising by weight percent 0.1 to 30 oxidizer, 0.01 to 3 inorganic salt or acid, 0.01 to 4 inhibitor, 0.1 to 30 abrasive, 0 to 15 complexing agent and balance water, wherein the aqueous composition has a pH between 1.5 to 6.

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patent: WO 02/31072 (2002-04-01), None

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