Multi-step method for metal deposition

Details Multi-step method for metal deposition Multi-step method for metal deposition

2005-03-08

2005-03-08

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating substrate prior to coating

C205S118000, C205S123000, C205S157000, C205S170000, C205S176000, C205S182000, C205S184000

Reexamination Certificate

active

06863795

ABSTRACT:
The invention is related to a method of plating of a metal layer on a substrate. The method is particularly preferred for the formation of metallization structures for integrated circuits.

REFERENCES:
patent: 3328273 (1967-06-01), Crentz et al.
patent: 6319831 (2001-11-01), Tsai et al.
patent: 6350364 (2002-02-01), Jang
patent: 6517894 (2003-02-01), Hongo et al.
patent: 6534116 (2003-03-01), Basol

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