Multi-step EBR process for photoresist removal

Details Multi-step EBR process for photoresist removal Multi-step EBR process for photoresist removal

2007-07-24

2007-07-24

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Chemical etching

Vapor phase etching

C438S707000

Reexamination Certificate

active

10881340

ABSTRACT:
An edge bead removal process is disclosed. The process includes providing a wafer having a feature layer, coating a photoresist on the feature layer, rotating the wafer, and removing an edge bead from the wafer by removing an edge bump portion from the edge bead and removing an edge region from the edge bead.

REFERENCES:
patent: 4839311 (1989-06-01), Riley et al.
patent: 5783097 (1998-07-01), Lo et al.
patent: 2004/0126923 (2004-07-01), Benson

Affiliated with

Also associated with

Rating

Multi-step EBR process for photoresist removal does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-step EBR process for photoresist removal, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-step EBR process for photoresist removal will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3795358