Coating processes – Centrifugal force utilized
Patent
1997-09-11
1999-10-19
Bell, Janyce
Coating processes
Centrifugal force utilized
4273855, 437231, B05D 312
Patent
active
059685921
ABSTRACT:
The objective of the invention is to provide a resist material deposition method which allows reliable deposition using a small amount of resist material without unevenness.
The method of the present invention comprises the following processing steps: a first processing step in which the resist material is fed to the central portion of the semiconductor substrate, and a second processing step in which the aforementioned semiconductor substrate is rotated at a high velocity so that the aforementioned resist material spreads out smoothly toward the circumferential portion of the aforementioned semiconductor substrate. In the first processing step, the semiconductor substrate is rotated at a velocity in the range of 1000-1500 rpm; in the second processing step, the semiconductor substrate is rotated at a velocity in the range of 3000-3800 rpm.
REFERENCES:
patent: 4267212 (1981-05-01), Sakawaki
patent: 5238878 (1993-08-01), Shinohara
Mekata Tomoaki
Yoshida Masataka
Bell Janyce
Donaldson Richard L.
Kempler William B.
Texas Instruments Incorporated
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