Multi step coat

Coating processes – Centrifugal force utilized

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

4273855, 437231, B05D 312

Patent

active

059685921

ABSTRACT:
The objective of the invention is to provide a resist material deposition method which allows reliable deposition using a small amount of resist material without unevenness.
The method of the present invention comprises the following processing steps: a first processing step in which the resist material is fed to the central portion of the semiconductor substrate, and a second processing step in which the aforementioned semiconductor substrate is rotated at a high velocity so that the aforementioned resist material spreads out smoothly toward the circumferential portion of the aforementioned semiconductor substrate. In the first processing step, the semiconductor substrate is rotated at a velocity in the range of 1000-1500 rpm; in the second processing step, the semiconductor substrate is rotated at a velocity in the range of 3000-3800 rpm.

REFERENCES:
patent: 4267212 (1981-05-01), Sakawaki
patent: 5238878 (1993-08-01), Shinohara

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi step coat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi step coat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi step coat will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2052654

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.