Multi-stage heat sink

Details Multi-stage heat sink Multi-stage heat sink

1994-04-21

1995-08-01

Flanigan, Allen J.

Heat exchange

Gradated heat transfer structure

165185, 361692, F28F 1300

Patent

active

054373280

ABSTRACT:
A multi-stage heat sink for cooling an integrated circuit module is described. The heat sink is preferably formed by an assembly of plates. A unique arrangement of slots in each plate forms different stages of air flow channels. Each stage contains a different number of slots with the number of slots increasing in successive stages. Thermal conduction of heat away from the module through fins which define the air flow channels is balanced against convective heat transfer from air flow channel walls at each stage to improve total heat transport per heat sink volume and to achieve a very low thermal resistance heat sink.

REFERENCES:
patent: 2512540 (1950-06-01), Friedman
patent: 4103737 (1978-08-01), Perkins
patent: 4587595 (1986-05-01), Staples
patent: 4765397 (1988-08-01), Chrysler et al.
patent: 4918571 (1990-04-01), Grabbe
patent: 5002123 (1991-03-01), Nelson et al.
patent: 5072787 (1991-12-01), Nakamichi

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