Multi-site probe

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Details

C324S765010

Reexamination Certificate

active

07847568

ABSTRACT:
Various probe substrates for probing a semiconductor die and methods of use thereof are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first matrix array of conductor pins and a second matrix array of conductor pins on a probe substrate. The second matrix array of conductor pins is separated from the first matrix array of conductor pins by a first pitch along a first axis selected to substantially match a second pitch between a first semiconductor die and a second semiconductor die of a semiconductor workpiece.

REFERENCES:
patent: 4038599 (1977-07-01), Bove et al.
patent: 4692205 (1987-09-01), Sachdev et al.
patent: 5410259 (1995-04-01), Fujihara et al.
patent: 5804983 (1998-09-01), Nakajima et al.
patent: 6383825 (2002-05-01), Farnworth et al.
patent: 6407568 (2002-06-01), Mulligan et al.
patent: 6501289 (2002-12-01), Takekoshi
patent: 6535004 (2003-03-01), Mehta et al.
patent: 6552559 (2003-04-01), Hiromatsu
patent: 6586956 (2003-07-01), Aldaz et al.
patent: 6674296 (2004-01-01), Duckworth et al.
patent: 7009412 (2006-03-01), Chong et al.
patent: 2002/0063558 (2002-05-01), Takeuchi et al.
patent: 2003/0025517 (2003-02-01), Kiest et al.
patent: 2005/0212546 (2005-09-01), Lynch
patent: 2007/0170935 (2007-07-01), Huang et al.
patent: 1548450 (2005-06-01), None
patent: 1906215 (2008-04-01), None
patent: 1965422 (2008-09-01), None
patent: WO2007007852 (2007-01-01), None
MicroProbe , Inc.; Apollo™ Array Flat Tip Vertical Technology Product Sheet; Nov. 26, 2002.
MicroProbe , Inc.; Apollo™ Pointed Tip Vertical Technology Product Sheet; Nov. 26, 2002.
MJC Probe Inc.; MPI-VPC Technology for Dual Site Flip Chip IC Presentation; Apr. 6, 2007.
Tokyo Electron; P-12XL Product Sheet; http://www.tel.com/eng/product/wps/wpsp12x1.htm; Jul. 24, 2007.
Tokyo Electron; Wafer Probe Systems Information Sheet; http://www.tel.com/eng/product/wps/buwps.htm; Jul. 24, 2007.
Teradyne, Inc.; UltraFlex Product Sheet; http://www.teradyne.com/flex/ultraflex.html; Aug. 1, 2007.
Wentworth Laboratories, Inc.;Array Probe Card ProductWeb Page; http://www.wentworthlabs.com/product/cobra.htm; pp. 1-3; Jun. 2001.
Kulicke & Soffa Industries, Inc.; CobraProbe Advantage for Vertical Probing Web Page; http://www.kns.com/prodserv/pdfs/test/CobraProbe.pdf; pp. 1-4; 2001.
PCT/IB2008/002158 International Search Report.

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