Multi-resolution inspection system and method of operating same

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

Reexamination Certificate

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C356S237400

Reexamination Certificate

active

10813149

ABSTRACT:
A multi-resolution inspection system and method of operation. The system may comprise a first scanning system having a first resolution, wherein the first scanning system is operable to perform a first resolution scan of a surface area of an object to identify a location of a surface abnormality in the object. The system may also comprise a second scanning system having a second resolution, the second resolution being smaller than the first resolution. The second scanning system is operable to receive the location of the surface abnormality from the first scanning system and to automatically perform a second resolution scan of a defined region of the object around the location of the surface abnormality.

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Yamazaki, I. et al.; “Microscopy and Analysis of Wafer Particles Using a Semiconductor Defect Review System”; Hitachi Review, Hitachi Ltd., Tokyo, Japan, vol. 45, No. 1, Feb. 1, 1996, pp. 7-10.

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