Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2001-06-29
2004-09-21
Chambliss, Alonzo (Department: 2827)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S778000, C257S780000, C438S033000, C438S113000, C438S458000, C438S464000
Reexamination Certificate
active
06794751
ABSTRACT:
FIELD
The present invention is directed to multi-purpose planarizing/back-grind/pre-under-fill arrangements for bumped wafers and dies.
BACKGROUND
Mounting and packaging technologies of semiconductor circuits appear to be continuously in transition, With the continuing goal to achieve, for example, greater ease, lower manufacturing costs, and more reliable mounting and packaging arrangements. One such technology is that of bumped wafer and bumped die technology. Needed are improvements to the mounting and packaging arrangements for bumped wafers and very thin bumped die.
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patent: WO 02/23592 (2002-03-01), None
Blakely , Sokoloff, Taylor & Zafman LLP
Chambliss Alonzo
Intel Corporation
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