Multi-printed etch mask process to pattern features

Details Multi-printed etch mask process to pattern features Multi-printed etch mask process to pattern features

2005-12-22

2010-10-12

Tran, Binh X (Department: 1713)

Coating processes

Direct application of electrical, magnetic, wave, or...

Electrostatic charge, field, or force utilized

C427S467000, C427S511000

Reexamination Certificate

active

07811638

ABSTRACT:
A method for patterning fine features using multiple jet-printed etch masks includes forming an initial feature through a first jet-printed etch mask and re-shaping the initial feature through at least one additional jet-printed etch mask.

REFERENCES:
patent: 6872320 (2005-03-01), Wong et al.
patent: 6972261 (2005-12-01), Wong et al.
patent: 7061570 (2006-06-01), Imai
patent: 7125495 (2006-10-01), Street et al.
patent: 2004/0002225 (2004-01-01), Wong et al.
patent: 2005/0026410 (2005-02-01), Yamazaki et al.

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