Multi-plunger manual transfer mold die

Details Multi-plunger manual transfer mold die Multi-plunger manual transfer mold die

1992-10-14

1994-11-22

Bushey, Charles S.

Plastic article or earthenware shaping or treating: apparatus

Female mold and charger to supply fluent stock under...

Molding of thermosetting or cross-linking stock

26427217, 2643285, 2643288, 425572, 425588, 425127, 4251291, B29L 4500

Patent

active

053663683

ABSTRACT:
A preheaterless manual transfer mold die for encapsulating semiconductor elements in a process for packaging semiconductors. The preheaterless manual transfer mold die includes a multi-plunger assembly adapted for upward and downward movement to press the resin. A tablet loader is inserted into an upper mold die in order to charge tablets into plunger bushes of the upper mold die. After charging, the loader is pulled out of the upper mold die. The upper mold die receives the tablets from the tablet loader. The tablets are pressed by the multi-plungers. A lower mold die, clamped to the upper mold die, receives the resin tablets in a gel state from the upper mold die and fills cavities of chases with the resin to mold semiconductor elements.

REFERENCES:
patent: 3427688 (1969-02-01), Wilson
patent: 4347211 (1982-08-01), Bandoh
patent: 4388265 (1983-06-01), Bandoh
patent: 4511317 (1985-04-01), Bandoh
patent: 4580964 (1986-04-01), Repella
patent: 4632653 (1986-12-01), Plocher
patent: 4708613 (1987-11-01), Sera et al.
patent: 5158780 (1992-10-01), Schraven et al.

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