Multi-pitch test probe assembly for testing semiconductor...

Details Multi-pitch test probe assembly for testing semiconductor... Multi-pitch test probe assembly for testing semiconductor...

2007-02-20

2007-02-20

Nguyen, Vinh P. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S765010, C324S754090

Reexamination Certificate

active

10966917

ABSTRACT:
Die probing devices can include multiple sets of probe wires, where certain probe wires correspond to test pads and other correspond to bond pads. The probe wires can be electrically coupled to each other using either a space transformer or a probe card, to provide appropriate continuity. Probe wires can generally be arranged in numerous different patterns depending upon (for example) pad layout, wire configuration, wire type, and probe head design/manufacturing constraints.

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