Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-09-24
2000-04-04
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
H01R 909
Patent
active
060453672
ABSTRACT:
A pin grid array includes a base having a first surface and a second surface which is substantially parallel thereto. The base is formed with a plurality of apertures which open through the base, and a plurality of electrical connectors are mounted on the base. Specifically, the connectors are formed with a central portion, and each connector has two deflectable fingers which extend in opposite directions from this central portion. The central portion of the connector is embedded into the base to cantilever the fingers into juxtaposed apertures. When they are not deflected, one finger of the connector projects outwardly from its aperture and beyond the first surface of the base, while the other finger projects outwardly from its aperture and beyond the second surface of the base. In a plurality of apertures, one finger projects one way and another finger projects the other way. With this combination, the electrical contact tips of the fingers are arranged as two matrices, one over the first surface of the base and the other over the second surface. Thus, a plurality of circuits are established between the first surface of the array and the second surface.
REFERENCES:
patent: 4021091 (1977-05-01), Anhalt et al.
patent: 4159154 (1979-06-01), Arnold
patent: 4538864 (1985-09-01), Ichimura
patent: 4867689 (1989-09-01), Redmond et al.
patent: 4976629 (1990-12-01), Werner
patent: 5139427 (1992-08-01), Boyd et al.
patent: 5147207 (1992-09-01), Mowry
patent: 5161982 (1992-11-01), Mowry
patent: 5380210 (1995-01-01), Grabbe et al.
patent: 5395252 (1995-03-01), White
patent: 5462440 (1995-10-01), Rothenberger
patent: 5746607 (1998-05-01), Bricaud et al.
Abrams Neil
Patel T C
Teledyne Industries Inc.
LandOfFree
Multi-pin connector does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Multi-pin connector, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-pin connector will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-359659