Multi-piece fiber optic component and manufacturing technique

Optical waveguides – With disengagable mechanical connector – Structure surrounding optical fiber-to-fiber connection

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C385S071000

Reexamination Certificate

active

06899465

ABSTRACT:
An apparatus for use in a commercial fiber optic connector is made up of an assembly of a set of slices. Each of the slices having multiple through holes of a specified arrangement. At least some of the through holes on any two adjoining slices are aligned with respect to each other so as to define a conduit between them. A transmission medium is within the holes. A method of making a fiber optic connector adapted to receive a fiber bearing unit is also described. The method involves coupling at least two high precision pieces together, the at least two high precision pieces having holes configured with an optical medium inserted therein after the coupling and cured to form a waveguide structure, coupling the at least two high precision pieces to a low precision piece to form a unit, and housing the unit within a fiber optic connector housing.

REFERENCES:
patent: 3825318 (1974-07-01), Croset et al.
patent: 4230385 (1980-10-01), Ammon et al.
patent: 4744627 (1988-05-01), Chande et al.
patent: 5214730 (1993-05-01), Nagasawa et al.
patent: 5241612 (1993-08-01), Iwama
patent: 5259052 (1993-11-01), Briggs et al.
patent: 5400429 (1995-03-01), Ames et al.
patent: 5446815 (1995-08-01), Ota et al.
patent: 5473716 (1995-12-01), Lebby et al.
patent: 5548675 (1996-08-01), Shigematsu et al.
patent: 5550942 (1996-08-01), Sheem
patent: 5579426 (1996-11-01), Li et al.
patent: 5613024 (1997-03-01), Shahid
patent: 5671311 (1997-09-01), Stillie et al.
patent: 5743785 (1998-04-01), Lundberg et al.
patent: 5815621 (1998-09-01), Sakai et al.
patent: 5853626 (1998-12-01), Kato
patent: 6012856 (2000-01-01), Kim et al.
patent: 6238100 (2001-05-01), Sasaki et al.
patent: 6246813 (2001-06-01), Zheng
patent: 6292529 (2001-09-01), Marcovici et al.
patent: 6324316 (2001-11-01), Fouquet et al.
patent: 6379053 (2002-04-01), van Doorn
patent: 6442306 (2002-08-01), Dautartas et al.
patent: 6496624 (2002-12-01), Hikita et al.
patent: 2002/0131752 (2002-09-01), Boudreau et al.
patent: 2002/0197047 (2002-12-01), Baswavanhally et al.
Ayliffe, M.H., “Optomechanical, electrical and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects”,SPIE, vol. 3490, pp. 502-505. 1998.
G. Proudley, et al., “Fabrication of two dimensional fiber optic arrays for an optical crossbar switch,” Optical Engineering, vol. 33, #2, pp. 627-635 . Feb. 1994.
Kosaka, M. et al., “Plastic-Based Receptacle-Type VCSEL-Array modules with One and Two Dimensions Fabricated using the self-Alignment Mounting Technique,” IEEE Electronic Components and Technology Conference, pp. 382-390 (1997).
International Search Report dated Dec. 13, 2002.
International Search Report dated Dec. 17, 2002.
International Search Report dated Jan. 3, 2003.
Ishida, H. et al., “Two-dimensionally arranged 24-fiber optical connectors”,OFC '97 Technical Digest, pp. 189-190, 1997.
Jöhnck M. et al., “8X* Pof Based Interchip Interconnection with 2.5 Gbit/s Per Channel Data Transmission”, ECOC '98, pp. 35 and 36, Sep. 20-24, 1998.
Koyabu, K. et al., “Fabrication of Two-Dimensional Fiber Arrays Using Microferrules”,IEEE, pp. 11-19, 1998.
Lee, S.S., et al. “Self-Aligned Integration of 8×1 Micromachined Micro-Fresnel Lens Arrays And 8×1 Vertical Cavity Surface Emitting Laser Arrays For Free-Space Optical Interconnect”,IEEE, pp. 31.2.1-31.2.4, 1994.
Liu, Yongsheng et al., “Design, implementation, and characterization of a hybrid optical interconnect for a four-stage free-space optical backplane demonstrator”,Applied Optics, vol. 37, No. 14, pp. 2895-2911, May 10, 1998.
Maj, T. et al., “Interconnection of a two-dimensional array of vertical-cavity surface-emitting lasers to a receiver array by means of a fiber image guide”,Applied Optics, vol. 39, No. 5, pp. 683-689, Feb. 10, 2000.
McCormick, F.B., “Smart Pixel Optics and Packaging”, IEEE/LEOS Summer Topical Meeting: Smart Pickels, pp. 45 and 46, Aug. 1996.
Ohki, A. et al., “Multi-channel optical coupling between VCSEL arrays and multimode optical fibers for a 40-channel parallel optical interconnection module”,IEEE, pp. 47 and 48, 1998.
Sasian, J. et al., “Fabrication of fiber bundle arrays for free-space photonic switching systems”,Optical Engineer, vol. 33, No. 9, pp. 2979-2985, Sep. 1994.
Söchtig, J. et al., “Replicated Plastic Optical Components for Optical Micro Systems”,IEEE, pp. 37 and 38, 1998.
Tooley, F., “Challenges in Optically Interconnecting Electronics”,IEEE Journal Of Selected Topics In Quantum Electronics, vol. 2, No. 1, pp. 3-13, Apr. 1996.
Ayliffe, M.H., “Optomechanical, electrical and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects”,SPIE, vol. 3490, pp. 502-505.
Basavanhally, N.R. et al., “Optoelectronic Packaging of Two-Dimensional Surface Active Devices”,IEEE Transactions On Components, Packaging, And Manufacturing Technology—Part B, vol. 19, No. 1, pp. 107-114, 1996.
Boisset, G.C. et al., “On-Die Diffractive Alignment Structures for Packaging of Microlens Arrays with 2-D Optoelectronic Device Arrays”,IEEE Photonics Technology Letters, vol. 8, No. 7, pp. 918-920, Jul. 1996.
Cryan, C.V., “Two-dimensional multimode fibre array for optical interconnects”,IEEE Electronic Letters Online No. 19980073, Oct. 23, 1997.
Giboney, K.S., “Parallel-Optical Interconnect Development at HP Laboratories”,SPIE, vol. 3005, pp. 193-201, Feb. 1997.
Hall, J.P. et al., “Packaging of VCSEL, MC-LED and Detector 2-D Arrays”, Electronic Components and Technology Conference, pp. 778-782, 1998.
Hayashi T. and Tsunetsugu H, “Optical Module with MU Connector Interface Using Self-alignment Technique by Solder-bump Chip Bonding”, Electronic Components and Technology Conference, p. 13-19, 1996.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-piece fiber optic component and manufacturing technique does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-piece fiber optic component and manufacturing technique, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-piece fiber optic component and manufacturing technique will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3444287

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.