Multi-part lead frame with dissimilar materials and method of ma

Details Multi-part lead frame with dissimilar materials and method of ma Multi-part lead frame with dissimilar materials and method of ma

1999-06-23

2000-10-31

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 438121, H01L 2144, H01L 2148, H01L 2150

Patent

active

061401544

ABSTRACT:
A multi-part lead frame die assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.

REFERENCES:
patent: 4984059 (1991-01-01), Kubota et al.
patent: 5014113 (1991-05-01), Casto
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5336639 (1994-08-01), Nagaraj et al.
patent: 5339518 (1994-08-01), Tran et al.
patent: 5394607 (1995-03-01), Chiu et al.
patent: 5796162 (1998-08-01), Huang
patent: 5907769 (1999-05-01), Corisis

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