Multi-part lead frame with dissimilar materials

Details Multi-part lead frame with dissimilar materials Multi-part lead frame with dissimilar materials

2005-09-20

2005-09-20

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S667000

Reexamination Certificate

active

06946722

ABSTRACT:
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.

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