Multi-part lead frame

Details Multi-part lead frame Multi-part lead frame

2008-01-22

2008-01-22

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257SE23042, C257S676000, C257S667000, C257S698000, C257S784000, C257S786000

Reexamination Certificate

active

11137034

ABSTRACT:
A multi-part lead frame semiconductor device assembly is disclosed including a die bonded to a die paddle. A second lead frame including leads is superimposed and bonded onto the first lead frame. Also disclosed is a method for fabricating the multi-part lead frame semiconductor device assembly which utilizes equipment designed for single lead frame processing. If desired, the materials for the multi-part lead frame may be dissimilar.

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