Multi-opening heat-dissipation device for high-power...

Details Multi-opening heat-dissipation device for high-power... Multi-opening heat-dissipation device for high-power...

2005-07-05

2005-07-05

Feild, Lynn (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C165S080300

Reexamination Certificate

active

06914782

ABSTRACT:
A multi-opening heat-dissipation device for high-power electronic components includes a body, an extension extended from the body, and a radial fan. The radial fan is mounted on a bottom aperture of the body. The body further comprises a primary opening on a first face and a cavity communicating between the bottom aperture and the primary opening as a wind path. The body further includes at least one additional opening on a second face of the body. The at least one additional comprises a second opening faces a circuit board on which a high-power electronic component is mounted. The cool air can flow to at least one of the topside and bottom side of the circuit board through the second opening and cool the high-power electronic components directly.

REFERENCES:
patent: 5898568 (1999-04-01), Cheng
patent: 5966286 (1999-10-01), O'Connor et al.
patent: 6407921 (2002-06-01), Nakamura et al.
patent: 6474409 (2002-11-01), Sterner

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