Multi-offset die head

Details Multi-offset die head Multi-offset die head

2007-06-29

2009-06-30

Nguyen, Ha Tran T (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S758010, C324S1540PB

Reexamination Certificate

active

07554348

ABSTRACT:
An upper die portion of a die head for aligning probes having different offsets in a first array of first micro-holes formed in a lower die portion of the die head. The upper die portion includes a spacer portion and a first assembly aid film. The spacer portion includes first and second surfaces. The first surface contacts the lower die portion. The first assembly aid film is attached with the second surface and has a second array of second micro-holes for receiving the probes having different offsets. The second micro-holes include at least a first micro-hole that is configured to be offset from a corresponding micro-hole of the first micro-holes by a first offset and at least a second micro-hole that is configured to be offset from a corresponding micro-hole of the first micro-holes by a second offset that is not the same as the first offset.

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