Multi-light emitting diode package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – Plural light emitting devices

Reexamination Certificate

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Details

C257S099000, C257S098000, C257S431000, C257S433000, C257SE33058, C257SE33061

Reexamination Certificate

active

07960744

ABSTRACT:
A multi-LED package includes a heat sink including a primary slug and a secondary slug separated from each other, a primary LED chip mounted on the primary slug, one or more secondary LED chips mounted on the secondary slug, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip. Another multi-LED package includes a heat sink having an upper surface and partitions protruding therefrom, a primary LED chip mounted inside the partitions, one or more secondary LED chips mounted outside the partitions, a lead frame structure electrically wired to the primary and secondary LED chips, and a phosphor covering at least a part of the primary LED chip.

REFERENCES:
patent: 7138667 (2006-11-01), Barnett et al.
patent: 7303315 (2007-12-01), Ouderkirk et al.
patent: 2007/0063321 (2007-03-01), Han et al.
patent: 10-0558082 (2006-02-01), None
patent: WO2006059828 (2006-06-01), None

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