Multi-level wiring structure having an organic interlayer insula

Details Multi-level wiring structure having an organic interlayer insula Multi-level wiring structure having an organic interlayer insula

1992-08-28

1994-05-10

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, 174262, 361767, 361772, 361784, H05K 100

Patent

active

053109651

ABSTRACT:
To perform a stable wire bonding connecting against a multi-level wiring board using an organic material for the interlayer insulating film, a silicon oxide film and organic interlayer insulating films, for example, polyimide layers, and the first to the fourth level wirings, including a nickel layer by plating are formed on the surface of the silicon substrate as a base in order. By adjusting the thickness of the nickel layer in the wiring, the total Vickers hardness from the substrate to each wiring is adjusted to more than 100, respectively.

REFERENCES:
patent: 4125648 (1978-11-01), Vratny
patent: 4541035 (1985-09-01), Carlson et al.
patent: 5111278 (1992-05-01), Eichelberger
patent: 5144747 (1992-09-01), Eichelberger
patent: 5152869 (1992-10-01), Ferraris et al.

Affiliated with

Also associated with

Rating

Multi-level wiring structure having an organic interlayer insula does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-level wiring structure having an organic interlayer insula, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-level wiring structure having an organic interlayer insula will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2413528