Multi-level sealing method

Details Multi-level sealing method Multi-level sealing method

1988-10-03

1990-02-13

Lowe, James

Plastic and nonmetallic article shaping or treating: processes

With measuring, testing, or inspecting

264254, 264255, 26427213, 26427218, B29C 3910

Patent

active

049004867

ABSTRACT:
A multi-level sealing method wherein an electrical element to be sealed is heated. Once heated, a quick curing first seal is applied to the electrical element thereby preventing the introduction of moisture, and other elements, into an electrical element as the seal cures. A second seal is applied, over the first seal and the element, that is high temperature and slow curing. As a result, the second seal has a different grain structure and the likelihood of a common moisture path into the electrical element is substantially eliminated. Therefore, once the high temperature, slow curing, second seal has cured, the reintroduction of moisture into the electrical element is prohibited. Additional layers of sealant may be added, if desired.

REFERENCES:
patent: 2194703 (1940-03-01), Kater
patent: 3517111 (1970-06-01), Johnson
patent: 3670091 (1972-06-01), Frantz
patent: 4576768 (1986-03-01), Markert et al.
WO88/00135, Potted Electrical/Mechanical Devices, and Dual Cure Potting Method, Drain et al. 1-14-88 (264/272.18).

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