Multi-level interconnection network

Details Multi-level interconnection network Multi-level interconnection network

2011-01-18

2011-01-18

Sheikh, Ayaz R (Department: 2476)

Multiplex communications

Network configuration determination

C370S255000, C370S400000, C370S401000, C370S404000, C370S405000, C370S406000, C709S220000, C709S221000, C709S222000, C709S223000, C709S224000

Reexamination Certificate

active

07872990

ABSTRACT:
A method and system for providing a multi-level interconnection network is provided. A multi-level interconnection network comprises basic cells that are aggregated into higher level cells at each level of the network. At the first level, the basic cells are aggregated into first level cells. Each first level cell is an aggregation of a number of basic cells that is one more than the number of devices in a basic cell. The basic cells of a first level cell are fully connected; that is, each basic cell has a first level link or connection to each other basic cell. In a first level cell, each device of a basic cell has a first level link to each other basic cell. The multi-level interconnection network has higher level cells that are aggregations of lower level cells in a similar manner.

REFERENCES:
patent: 5592610 (1997-01-01), Chittor
patent: 5669008 (1997-09-01), Galles et al.
patent: 6230252 (2001-05-01), Passint et al.
patent: 6289424 (2001-09-01), Stevens
patent: 6754207 (2004-06-01), Hesse
patent: 7054867 (2006-05-01), Bosley et al.
patent: 7075892 (2006-07-01), Grover et al.
patent: 7113506 (2006-09-01), Cao
patent: 2005/0074019 (2005-04-01), Handforth et al.
patent: 2005/0076104 (2005-04-01), Liskov et al.
patent: 2005/0209889 (2005-09-01), Funahashi
patent: 2008/0025208 (2008-01-01), Chan
patent: 2008/0032705 (2008-02-01), Patel et al.
patent: 2009/0037500 (2009-02-01), Kirshenbaum
patent: 2009/0089410 (2009-04-01), Vicente
patent: 2009/0113172 (2009-04-01), Deneroff et al.
patent: 2009/0237111 (2009-09-01), Mayer et al.
patent: 2009/0274043 (2009-11-01), Guo et al.
patent: WO-9821857 (1998-05-01), None
“Scaling Internet Data Center Infrastructures to Improve Delivery of Web-Based Services” ©2007 WovenSystems Inc., 2 pages. <URL: www.wovensystems.com>.
Ganesan, et al., “Wormhole Routing in De Bruijn Networks and Hyper-DeBruijn Networks”. In: Proceedings of the 2003 International Symposium on vol. 3, May 25-28, 2003, 4 pages. <URL: Citeseer.ist.psu.edu/ganesan03wormhole.html> [Last accessed Feb.13, 2009].
Kumar, et al., “Extended Hypercube: A Hierarchical Interconnection Network of Hypercubes”. In: IEEE Transactions on Parallel and Distributed Systems, vol. 3, No. 1, Jan. 1992, pp. 45-57. <URL: http://ieeexplore.ieee.org/Xplore/login.jsp?url=/ie14/71/3359/00113081.pdf?temp=x> [Last accessed on Feb. 13, 2009].
Latifi, et al., “Incomplete Star: An Incrementally Scalable Network Based on the Star Graph”. In: IEEE Transactions on Parallel and Distributed Systems, vol. 5, No. 1, Jan. 1994, pp. 97-102. <URL: ieeexplore.ieee.org/ie14/71/6611/00262593.pdf?arnumber=262593 -> [Last accessed on Feb. 13, 2009].
Linder, et al., “An Adaptive and Fault Tolerant Wormhole Routing Strategy for K-ary n-cubes”. In: IEEE Transactions on Computers, vol. 40, No. 1, Jan. 1991, pp. 2-12. ISSN 0018-9340, Publisher IEEE Computer Society, Washington, DC, USA,. <URL:http://dx.doi.org/10.1109/12.67315>. [Last accessed Feb. 13, 2009].
Tripathy, C. R., “Star-Cube: A New Fault-tolerant Interconnection Topology for Massively Parallel Systems”. Journal, Institution of Engineers India part of Electronics and Telecommunications Engineering Division, vol. 84, Jan. 2004, pp. 83-92. <URL: http://www.ieindia.org/publish/et/0104/jan04et7.pdf>. [Last accessed Feb. 13, 2009].
Wei, Shi. et al., “Hyper-Butterfly Network: A Scalable Optimally Fault Tolerant Architecture”. In: Proceedings of 1998 IPPS/SPDP, 5 pages. <URL: http://ipdps.cc.gatech.edu/1998/papers/105.pdf> [Last accessed on Feb. 13, 2009].

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