Multi-level integrated photonic devices

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S045000, C438S712000

Reexamination Certificate

active

07972879

ABSTRACT:
A laser and electroabsorption modulator (EAM) are monolithically integrated through an etched facet process. Epitaxial layers on a wafer include a first layer for a laser structure and a second layer for an EAM structure. Strong optical coupling between the laser and the EAM is realized by using two 45-degree turning mirrors to route light vertically from the laser waveguide to the EAM waveguide. A directional angled etch process is used to form the two angled facets.

REFERENCES:
patent: 5987046 (1999-11-01), Kobayashi et al.
patent: 6885795 (2005-04-01), Hsu et al.
patent: 6940885 (2005-09-01), Cheng et al.
patent: 001017141 (2000-07-01), None
patent: 57-190516 (1982-12-01), None
patent: 3-266490 (1991-11-01), None
patent: 4-104107 (1992-04-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-level integrated photonic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-level integrated photonic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-level integrated photonic devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2700286

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.