Multi-level circuit structure utilizing conductive cores having

Details Multi-level circuit structure utilizing conductive cores having Multi-level circuit structure utilizing conductive cores having

1989-12-29

1992-06-09

Tolin, Gerald P.

Electricity: electrical systems and devices

Miscellaneous

174261, 361388, 361396, 361414, 439 74, H05K 108

Patent

active

051212994

ABSTRACT:
A multi-level circuit structure is provided which includes a plurality of overlying substrates, each having at least one conductive core. A plurality of imprinted depressions are formed in each substrate, each depression having a convex surface and a concave surface. Dielectric coatings are utilized to provide insulation between adjacent substrates and by selectively placing a conductive mass between selected overlying imprinted depressions an electrical connection may be formed between adjacent imprinted depressions wherein selected portions of one substrate may be electrically coupled to selected portions of a second substrate.

REFERENCES:
patent: 3436819 (1969-04-01), Lunine
patent: 3606677 (1971-09-01), Ryan
patent: 3795047 (1974-03-01), Abolafia
patent: 4074342 (1978-02-01), Horn
patent: 4191789 (1980-03-01), Brown
patent: 4496793 (1985-01-01), Hanson
patent: 4617730 (1986-10-01), Geldermans
patent: 4882454 (1989-11-01), Peterson
patent: 4908940 (1990-03-01), Amano
patent: 4963697 (1990-10-01), Peterson
patent: 4967314 (1990-10-01), Higgins

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