Multi-lead hermetic power package with high packing density

Details Multi-lead hermetic power package with high packing density Multi-lead hermetic power package with high packing density

1990-04-30

1992-04-21

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H01L 2304

Patent

active

051070740

ABSTRACT:
An hermetic package for power semiconductor devices is disclosed. The package includes a generally rectangular cavity with leads extending through the walls thereof. The bottom of the cavity is defined by a base which includes a pair of mounting tabs protruding from opposite corners thereof. The mounting tabs are configured to allow the packages to be nested together. A cover attached to the walls provides a hermetically sealed package.

REFERENCES:
patent: 3206704 (1964-09-01), Hay
patent: 3876926 (1975-04-01), Schott et al.
patent: 4506108 (1985-03-01), Kersch et al.
patent: 4546412 (1985-10-01), Nakazawa et al.
patent: 4636580 (1987-01-01), Neidig et al.
patent: 4672151 (1987-06-01), Yamamura
patent: 4972043 (1990-11-01), Noll et al.

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