Multi-layered wiring board for slot coupling a transmission...

Details Multi-layered wiring board for slot coupling a transmission... Multi-layered wiring board for slot coupling a transmission...

2005-03-22

2005-03-22

Lee, Benny (Department: 2817)

Wave transmission lines and networks

Coupling networks

Balanced to unbalanced circuits

C333S247000

Reexamination Certificate

active

06870438

ABSTRACT:
A wiring board includes a dielectric substrate, a signal transmission line formed on one surface of the dielectric substrate, a grounded layer formed on the other surface of the dielectric substrate, and a connection portion for connecting portion for connecting the signal transmission line to a waveguide, the connection portion being formed on the grounded layer. The grounded layer has a slot at a position opposed to an end of the signal transmission line. The connection portion includes a first dielectric portion disposed to cover the slot of the ground layer, a second dielectric portion laminated on the first dielectric portion, and a patch conductor provided at a position opposed to said slot on an interface between the first dielectric portion and the second dielectric portion. The wiring board enables the signals to be efficiently transmitted from the signal transmission line to the waveguide with a small loss and a small reflection.

REFERENCES:
patent: 5396202 (1995-03-01), Scheck
patent: 5539361 (1996-07-01), Davidovitz
patent: 5793263 (1998-08-01), Pozar
patent: 6239669 (2001-05-01), Koriyama et al.

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