Multi-layered superconductive interconnects

Details Multi-layered superconductive interconnects Multi-layered superconductive interconnects

1995-07-18

1996-11-26

Powell, William

Etching a substrate: processes

Adhesive or autogenous bonding of two or more...

216 88, 216101, 505410, 505820, B44C 122

Patent

active

055782264

ABSTRACT:
A multi-layer superconductive interconnect structure includes a first multi-layer substrate with a first superconducting layer (SL) deposited on a first epitaxial substrate and a first glue dielectric layer (GDL) on the first SL. A second multi-layer substrate includes a second SL deposited on a second epitaxial substrate and a second GDL on said second SL. The first GDL and the second GDL are clamped and cured together to form a composite substrate.

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