Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1996-09-13
2000-06-13
Jones, Deborah
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
361794, 361795, 333246, H05K 103
Patent
active
060752114
ABSTRACT:
There is provided a multi-layered printed wiring board including a power supply layer, a ground layer, a signal layer, and insulators sandwiched between those layers. The power supply layer is provided with a circuit in the form of wirings for imparting impedance thereto. For instance, the power supply layer may be formed to include main wirings for distributing a dc current entirely to the printed wiring board with a dc voltage drop being depressed, and branch wirings for enhancing high frequency impedance to isolate circuits in terms of high frequency, which circuits are mounted on the multi-layered printed wiring board and operated independently with each other. The invention makes it possible to provide a relatively great inductance to thereby decrease high frequency power supply current which is generated on IC/LSI operation and is to flow into decoupling capacitors. In addition, in accordance with the present invention, it is possible to identify a route through which a current runs into the power supply layer to thereby provide an optimal decoupling capacitor to every IC/LSI as a source of high frequency power supply current.
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Tohya Hirokazu
Yoshida Shiro
Jones Deborah
Lam Cathy F.
NEC Corporation
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