Multi-layered micro-channel heat sink

Heat exchange – Intermediate fluent heat exchange material receiving and... – Liquid fluent heat exchange material

Reexamination Certificate

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Details

C165S080300

Reexamination Certificate

active

11242739

ABSTRACT:
The subject invention provides a heat sink for a liquid cooling system. The heat sink includes a spreader plate for contacting an electronic device and a body having a plurality of channels extending through the body and arranged in layers. Each layer includes a quantity of the channels decreasing in number with an increase in the distance from the electronic device, thus giving the heat sink a trapezoidal cross section perpendicular to the channels.

REFERENCES:
patent: 5437328 (1995-08-01), Simons
patent: 5527588 (1996-06-01), Camarda et al.
patent: 5697428 (1997-12-01), Akachi
patent: 6542371 (2003-04-01), Webb
patent: 6989134 (2006-01-01), Tonkovich et al.
patent: 7123479 (2006-10-01), Chang et al.
patent: 2002/0079087 (2002-06-01), Vafai et al.
patent: 2004/0066625 (2004-04-01), Meyer et al.
patent: 2005/0039885 (2005-02-01), Vaidyanathan

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