Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate
2007-11-27
2007-11-27
Patel, Ishwar (I. B.) (Department: 2841)
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
C174S255000
Reexamination Certificate
active
10959711
ABSTRACT:
A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.
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Japanese Office Action dated Feb. 27, 2007.
Egitto Frank D.
Farquhar Donald S.
Markovich Voya R.
Poliks Mark D.
Powell Douglas O.
International Business Machines - Corporation
Kaschak, Esq. Ronald
Patel Ishwar (I. B).
Scully , Scott, Murphy & Presser, P.C.
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