Multi-layered flexible print circuit board and manufacturing...

Details Multi-layered flexible print circuit board and manufacturing... Multi-layered flexible print circuit board and manufacturing...

2007-09-04

2007-09-04

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S842000, C029S845000, C228S180100, C228S180210, C228S180220

Reexamination Certificate

active

11252540

ABSTRACT:
A multi-layered flexible print circuit board comprising an insulating layer, a circuit layer formed on the front and back surfaces of the insulating layer and a hole connecting between the circuit layers via the insulating layer, wherein there is provided an electrically-conductive member having a metal layer formed thereon at least on the surface thereof which is press-fitted into the hole to electrically conduct the circuit layer.

REFERENCES:
patent: 6300576 (2001-10-01), Nakamura et al.
patent: 6768064 (2004-07-01), Higuchi et al.
patent: 6831236 (2004-12-01), Higuchi et al.
patent: 6914200 (2005-07-01), Higuchi et al.
patent: 2001/0029666 (2001-10-01), Nakamura et al.
patent: 2002/0157248 (2002-10-01), Karlsson et al.
patent: 2003/0003779 (2003-01-01), Rathburn
patent: 2004/0195002 (2004-10-01), Higuchi et al.
patent: 2005/0205291 (2005-09-01), Yamashita et al.
patent: 5-175636 (1993-07-01), None
patent: 7-176847 (1995-07-01), None
English Language Abstract of JP 5-175636, published Jul. 13, 1993.
English Language Abstract of JP 7-176847, published Jul. 14, 1995.

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