Multi-layered circuit board assembly with improved thermal...

Details Multi-layered circuit board assembly with improved thermal... Multi-layered circuit board assembly with improved thermal...

2007-12-18

2007-12-18

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S260000, C174S261000, C174S262000, C174S263000, C174S264000, C174S521000, C174S526000, C174S546000, C174S547000, C361S760000, C361S761000, C361S762000, C361S763000, C361S764000

Reexamination Certificate

active

10891127

ABSTRACT:
A circuit board assembly includes an electrical component mounted on or in the assembly; a conductive layer, which is electrically connected to the electrical component; a high-temperature dissipation resin, which is of insulating material and is arranged so as to dissipate heat generated in the assembly; and a molding resin surrounding the electrical component. Heat, generated at electrical components in a circuit board assembly, is transferred and dispersed through the high-temperature dissipation material all over the assembly. Further, since the high-temperature dissipation resin is of an insulating material, it is unnecessary to consider a short-circuit problem in the assembly.

REFERENCES:
patent: 4827328 (1989-05-01), Ozawa et al.
patent: 4849284 (1989-07-01), Arthur et al.
patent: 5290624 (1994-03-01), Bujard
patent: 5391924 (1995-02-01), Uchida et al.
patent: 5500785 (1996-03-01), Funada
patent: 5586007 (1996-12-01), Funada
patent: 5597643 (1997-01-01), Weber
patent: 5900312 (1999-05-01), Sylvester
patent: 6111308 (2000-08-01), Newman
patent: 6117710 (2000-09-01), Mostafazadeh et al.
patent: 6307755 (2001-10-01), Williams et al.
patent: 6353189 (2002-03-01), Shimada et al.
patent: 6538210 (2003-03-01), Sugaya et al.
patent: 6713851 (2004-03-01), Umehara et al.
patent: 6784022 (2004-08-01), Umehara et al.
patent: 6855892 (2005-02-01), Komatsu et al.
patent: 6955948 (2005-10-01), Asahi et al.
patent: 2002-329939 (2002-11-01), None

Affiliated with

Also associated with

Rating

Multi-layered circuit board assembly with improved thermal... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layered circuit board assembly with improved thermal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layered circuit board assembly with improved thermal... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3891215