Multi-layer wiring substrate, and process for producing the same

Details Multi-layer wiring substrate, and process for producing the same Multi-layer wiring substrate, and process for producing the same

1995-05-12

1998-03-17

Speer, Timothy

Stock material or miscellaneous articles

Composite

Of quartz or glass

428432, 428433, 428434, 428469, 428472, 428450, B32B 1500

Patent

active

057284709

ABSTRACT:
A multi-layer wiring substrate includes an insulating layer which is essentially formed of a silica sintered product, and a conductor layer formed on an upper surface of the insulating layer from an electrically conductive material. The multi-layer wiring substrate is produced by forming a green sheet from a starting powder such as an ultrafine powder of amorphous silica having an average particle size of several to tens nm, and firing or calcining the green sheet at a temperature of 800.degree. to 1,200.degree. C. in an atmosphere containing steam to provide a silica sintered product which is sintered to a sufficient extent and has a high strength. The starting powder has a composition which comprises 95.0 to 99.5% by weight of a fine silica powder, 0.05 to 5.0% by weight of an alkaline earth metal compound, or comprises 95.0 to 99.0% by weight of a fine silica powder and 1.0 to 5.0% by weight of B.sub.2 O.sub.3. The silica sintered product has a sufficiently high strength and a dielectric constant of 4.0 at 1 MHz.

REFERENCES:
patent: 4336048 (1982-06-01), van der Steen
patent: 4457972 (1984-07-01), Griffith
patent: 4547625 (1985-10-01), Tosaki
patent: 5071793 (1991-12-01), Jean
patent: 5288558 (1994-02-01), Nothe

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