Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-09-27
1998-06-16
Ledynh, Bot L.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361795, 174256, 174257, 174258, 174260, 174262, 174264, H05K 111, H05K 109, H05K 100, H05K 116
Patent
active
057681082
ABSTRACT:
A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.
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Amagi Shigeo
Miura Osamu
Miwa Takao
Miyazaki Kunio
Satsu Yuichi
Hitachi , Ltd.
Ledynh Bot L.
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