Multi-layer wiring board

Details Multi-layer wiring board Multi-layer wiring board

2011-08-02

2011-08-02

Norris, Jeremy C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C361S794000

Reexamination Certificate

active

07989708

ABSTRACT:
In a multi-layer wiring board in which board wirings are arranged in a plurality of wiring layers so as to be connected via a through hole, two through holes are provided in parallel, and two through holes are connected therebetween in both end portions of the respective through holes or one end portion thereof by the wiring board.

REFERENCES:
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patent: 5543586 (1996-08-01), Crane et al.
patent: 5847936 (1998-12-01), Forehand et al.
patent: 6040524 (2000-03-01), Kobayashi et al.
patent: 6329604 (2001-12-01), Koya
patent: 6512181 (2003-01-01), Okubo et al.
patent: 6791035 (2004-09-01), Pearson et al.
patent: 2005/0063166 (2005-03-01), Boggs et al.
patent: 03-145791 (1991-06-01), None
patent: WO01/56338 (2001-08-01), None

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