Multi-layer type over-current and over-temperature...

Details Multi-layer type over-current and over-temperature... Multi-layer type over-current and over-temperature...

2008-01-11

2009-10-27

Lee, Kyung (Department: 2833)

Electrical resistors

Resistance value responsive to a condition

Current and/or voltage

C338S332000, C029S621000, C029S619000

Reexamination Certificate

active

07609143

ABSTRACT:
A multi-layer type over-current and over-temperature protection structure and a method of manufacturing the same are disclosed. The present invention utilizes the concept of multi-layer design to integrate more than two over-current and over-temperature protection elements on a component structure that can be adhered to a substrate. Hence, the over-current and over-temperature protection structure has more than two over-current and over-temperature protection functions at the same time. Therefore, the advantages of the present invention is that the over-current and over-temperature protection structure effectively integrates two or more over-current and over-temperature protection elements together in order to increase the usage range of the over-current and over-temperature protection structure. Moreover, the present invention effectively reduces size of the over-current and over-temperature protection elements on a PCB and reduces the number of solder joints.

REFERENCES:
patent: 5425099 (1995-06-01), Takakura et al.
patent: 6172591 (2001-01-01), Barrett
patent: 6297722 (2001-10-01), Yeh
patent: 6388555 (2002-05-01), McLoughlin
patent: 6686827 (2004-02-01), Chen et al.
patent: 7138900 (2006-11-01), Liu et al.

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