Multi-layer substrate having conductive pattern and resin...

Details Multi-layer substrate having conductive pattern and resin... Multi-layer substrate having conductive pattern and resin...

2006-05-11

2010-06-08

Levi, Dameon E (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C174S262000, C174S260000, C174S258000, C174S256000, C174S255000, C361S790000, C361S792000, C361S794000

Reexamination Certificate

active

07733665

ABSTRACT:
A multi-layer substrate connecting to an external electric device includes: a plurality of resin films; and a plurality of conductive patterns. The resin films are stacked together with the conductive patterns. The conductive pattern includes an inner conductive pattern and a surface conductive pattern. The inner conductive pattern is disposed inside of the multi-layer substrate for providing an inner circuit. The surface conductive pattern is exposed on the multi-layer substrate for connecting to the external electric device. The surface conductive pattern has a thickness in a stacking direction, which is thicker than a thickness of the inner conductive pattern.

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