Multi-layer substrate and manufacture method thereof

Details Multi-layer substrate and manufacture method thereof Multi-layer substrate and manufacture method thereof

2008-01-10

2010-02-02

Reichard, Dean A. (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C438S497000

Reexamination Certificate

active

07656679

ABSTRACT:
Disclosed are a multi-layer substrate and a manufacture method thereof. The multi-layer substrate of the present invention comprises a surface dielectric layer and at least one bond pad layer. The surface dielectric layer is located at a surface of the multi-layer substrate. The bond pad layer is embedded in the surface dielectric layer to construct the multi-layer substrate with the surface dielectric layer of the present invention. The manufacture method of the present invention forms at least one bond pad layer on a flat surface of a carrier and then forms the surface dielectric layer to cover the bond pad layer where the bond pad layer is embedded therein. After the multi-layer substrate is separated from the carrier, the bond pad layer and the surface dielectric layer construct a flat surface of the multi-layer substrate.

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patent: 2007/0218686 (2007-09-01), Wang et al.
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patent: 2005-347308 (2005-12-01), None

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