Multi-layer structures containing a silane adhesion promoting la

Details Multi-layer structures containing a silane adhesion promoting la Multi-layer structures containing a silane adhesion promoting la

1995-07-24

1997-03-25

Sellers, Robert E.

Stock material or miscellaneous articles

Composite

Of silicon containing

442232, B32B 2704

Patent

active

056143249

ABSTRACT:
A multi-layer structure utilized in the preparation of printed circuit boards comprises a metal foil layer, a prepreg layer containing a resin possessing carbon-carbon double bonds such as a polyimide, a polyester or a silicon-carbon resin, and an adhesion promoting layer of a non-epoxy group-containing hydrolyzable silane possessing a heterocyclic such as an imidazole or pyrrole; acryloxy, amide or a carbon-carbon double bond-containing group such as styryl.

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Chin et al, "Polyimide Technology to Meet the Packaging Needs of the 90's", Ciba-Geigy Corporation, Polymers Division, Product Bulletin.
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