Metal working – Method of mechanical manufacture – Electrical device making
Patent
1991-08-15
1992-12-22
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29838, 174266, 174267, 361414, H01R 914
Patent
active
051724723
ABSTRACT:
A multi-layer rigid prototype printed circuit board is fabricated by applying a heat activated, rapid setting or tacking melt-remelt adhesive utilizing a moderate temperature heat laminating device onto appropriate surfaces of pre-etched and plated insulative film based, flexible film layers. A computer guided drill drills through-holes within an electrical insulative material planar substrate core using prescribed drill sizes for each through-hole pin size desired for a given hole location. The etched layers with the adhesive applied are positioned in proper sequence aligned to the drilled hole pattern and heat laminated thereto as a stacked array on the top and/or bottom surfaces of the substrate core. Computer guided drilling of the adhered films with prescribed smaller drill sizes at each through-hole location is effected to create film cantilever portions extending radially outwardly of the edge of the through-holes. Unique, polygonal or like cross-section through-hole connector pins are inserted into the aligned holes within the flexible film layers and the substrate, with the pins having at least one radial projection forming a sharp corner which cuts into the conductor tracks of the multi-layer flexible film array to deflect and deform the cantilever edge portion of the multi-layer flexible films into the substrate through-holes for effecting a low impedance conductor track to pin to conductor track electrical connection for a plurality of the films. The conductor tracks at the cantilever edge portions may be provided with a solder film and heat applied by post-heating the through-hole connector pins or otherwise to facilitate a low impedance connection between the periphery of the through-hole connector pin and the conductor tracks of the multi-layer flexible film array. The application of heat remelts the adhesive facilitating flexing of the multi-layer flexible films and ensuring contact between the conductor tracks and the pin periphery.
REFERENCES:
patent: 4562301 (1985-12-01), Kameda et al.
patent: 4644643 (1987-02-01), Sudo
patent: 4653186 (1987-03-01), Kamijo et al.
Duncanson Paul A.
Lindner Frederick H.
Arbes Carl J.
Direct Imaging Inc.
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