Multi-layer RF filter and balun

Details Multi-layer RF filter and balun Multi-layer RF filter and balun

2007-02-13

2007-02-13

Enad, Elvin (Department: 2832)

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

Reexamination Certificate

active

11417409

ABSTRACT:
A filter-balun combination for filtering an RF input signal and balancing output RF signals is provided. The filter-balun combination is formed in a multi-layer planar substrate having multiple dielectric layers and multiple planar device layers having conducting material. The filter section includes first and second symmetrical inductors formed in the substrate. The inductors provide filtering for an input signal. The balun section includes a balun central transmission line connected to an output of the filter, and two output structures for providing the output from the filter-balun combination. The central transmission line follows a path through the substrate that includes first and second coil areas. The input line is sandwiched between upper and lower transmission lines in the first and second coil areas. The output of the filter-balun combination is a filtered, balanced signal at each of the two balun output structures.

REFERENCES:
Soshin Electric Co., Ltd., “Development Information,” Feb. 17, 2003 (1 page).
Wing-Yan Leung et al., “Multilayer LTCC Bandpass Filter Design With Enhanced Stopband Characteristics,” Jul. 2002 (pp. 240-242).
Ching-Wen Tang et al., “A Semi-lumped Balun Fabricated by Low Temperature Co-fired Ceramic,” 2002 (pp. 2201-2204).
A. Sutono et al., “Development of Integrated Three Dimensional Bluetooth Image Reject Filter,” 2000 (pp. 339-342).
Chih-ming Tsai et al., “A Generalized Model for Coupled Lines and its Applications to Two-Layer Planar Circuits,” Dec. 1992 (pp. 2190-2199).
Nathan Marchand, “Transmission-Line Conversion,” Dec. 1944 (pp. 142-145).
Toko, Inc., “Multilayer tip balun filter for XM radio” (1 page).
CTS Microelectronics, “Low-Temperature Cofired Ceramic Design and Layout Guidelines for the Fabrication of Networks, Packages and Multichip Modules” (pp. 1-14).
EPOCS, “LTCC Design Guidelines” (5 pages).

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