Multi-layer printed wiring board including an alignment mark...

Details Multi-layer printed wiring board including an alignment mark... Multi-layer printed wiring board including an alignment mark...

2006-01-13

2008-05-20

Patel, Ishwar ( I.B.) (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S255000

Reexamination Certificate

active

07375289

ABSTRACT:
A multi-layer printed wiring board includes a board covered with a conductor layer, an interlayer insulating resin layer, an etched metal film on the interlayer insulating resin layer, and a via hole. The interlayer insulating resin layer has a fibrous substrate. The via hole has an electrolytic plated film and an electrolessly plated film and connects the conductor layer of the board and the etched metal film.

REFERENCES:
patent: 4510276 (1985-04-01), Leech et al.
patent: 4642160 (1987-02-01), Burgess
patent: 5002637 (1991-03-01), Toyoshima et al.
patent: 5055321 (1991-10-01), Enomoto et al.
patent: 5073687 (1991-12-01), Inagawa
patent: 5263243 (1993-11-01), Taneda
patent: 5278385 (1994-01-01), Gerome et al.
patent: 5401909 (1995-03-01), Arnold
patent: 5451721 (1995-09-01), Tsukada et al.
patent: 5517758 (1996-05-01), Nakamura
patent: 5851646 (1998-12-01), Takahashi et al.
patent: 5879568 (1999-03-01), Urasaki et al.
patent: 6000124 (1999-12-01), Saito
patent: 6035526 (2000-03-01), Saruta
patent: 2 307 352 (1997-05-01), None
patent: 03-054884 (1991-03-01), None
patent: 403048488 (1991-03-01), None
patent: 4-162494 (1992-06-01), None
patent: 05020031 (1993-02-01), None
patent: 8-340165 (1996-12-01), None
patent: 9-29473 (1997-02-01), None
patent: 9-308981 (1997-12-01), None
patent: 10-200269 (1998-07-01), None

Affiliated with

Also associated with

Rating

Multi-layer printed wiring board including an alignment mark... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer printed wiring board including an alignment mark..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer printed wiring board including an alignment mark... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3987143