Telecommunications – Receiver or analog modulated signal frequency converter – Frequency modifying or conversion
Reexamination Certificate
1996-06-14
2001-07-17
Urban, Edward F. (Department: 2683)
Telecommunications
Receiver or analog modulated signal frequency converter
Frequency modifying or conversion
C455S330000, C333S246000
Reexamination Certificate
active
06263198
ABSTRACT:
FIELD OF THE INVENTION
This invention relates generally to broadside coupled microwave baluns, and more particularly to a printed wiring board having baluns which are embedded in a conventional multi-layer printed wiring board.
BACKGROUND OF THE INVENTION
Broadside coupled baluns are desirable building blocks for the design of broadband microwave and RF mixers. The broadside coupling design provide benefits compared to edge coupled structures. Of particular importance the broadside coupled balun exhibits superior performance due to strong odd mode couplings which increase the ratio of even mode to odd mode impedance, and due to a decrease in processing tolerance sensitivity. In the prior art, these baluns are constructed as discrete components on multi-layer thick film ceramic substrates or on a single layer Duroid board. Such prior art baluns are connected with other circuit elements to form microwave mixers, power amplifiers, and the like, and are generally housed in a metal package or plastic dual inline package. The packages are then attached to a printed wiring board (also commonly referred to as a “printed circuit board”). Such packages, however, are not compatible with printed wiring boards and thus require processing, such as soldering, to mount the packaged component to the board. The prior art baluns are relatively expensive because of the extensive and complex manufacturing processes required for their manufacturer and integration into the printed wiring board. Thus, it is desirable to provide a component that is compatible with conventional printed wiring boards and is less costly to manufacture.
OBJECTS AND SUMMARY OF THE INVENTION
It is an object of the present invention to provide a printed wiring board having an embedded microwave balun.
It is another object of the present invention to provide inexpensive microwave couplers which are integrated into a conventional printed circuit wiring board.
It is another object of the present invention to provide a microwave broadside coupled balun which is formed integral with a printed circuit board and connected to other circuit components carried by the printed circuit board to form microwave devices.
A further object of the present invention is to provide a mixer circuit having baluns formed integral with a printed circuit board.
These and other objects of the invention are achieved by a printed wiring board having integrated broadside microwave coupled baluns embedded in a multilayer printed wiring board.
REFERENCES:
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patent: 4495479 (1985-01-01), Hermann
patent: 4739519 (1988-04-01), Findley
patent: 5125111 (1992-06-01), Trinh
patent: 5440075 (1995-08-01), Kawakita et al.
patent: 5497137 (1996-03-01), Fujiki
Muller, “New Developments in Design Contruction of Multilayers”, Proceedings of the Printed Circuit World Convention II, vol. 1, Jun., 1981 pp. 68-71.
Hutkin, “Foiled by Gallium Arsenide”, Circuits Manufacturing, vol. 26, No. 6, Jun., 1986 pp. 53, 55, 57-58.
Huang, Jandzinski, Stafford, “Multi-Layer Teflon Circuits for RF Applications”, Proceedings of the 1995 International Electronics Packaging Conference, Sep., 1995 pp. 32-44.
RF Prime Corporation, “RF Prime Surface Mount Products”, RF Prime Corporation Databook, Sep., 1995 pp. 1-2, 7-8, 15-18, 23-24.
Flehr Hohbach Test Albritton & Herbert LLP
Urban Edward F.
WJ Communications, Inc.
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