Multi-layer printed substrate

Details Multi-layer printed substrate Multi-layer printed substrate

1995-11-09

1999-07-27

Kozma, Thomas J.

Inductor devices

With temperature modifier

Heat exchanging surfaces

336 83, 336200, 336232, H01F 2708, H01F 2730

Patent

active

059297336

ABSTRACT:
An area on which a coil part is formed on part of a substrate is secured, coil patterns are provided on a plurality of unit substrates corresponding to the area, the coil patterns of the laminated unit substrates are connected by a through hole to form the coil part, thereby resulting in miniaturization, reduction of the number of assembling processes, reduction of cost, noise prevention, and improvement of reliability. Heat radiation patterns are provided in unitary form on the coil patterns to secure a sufficient heat radiation property.

REFERENCES:
patent: 4012703 (1977-03-01), Chamberlayne
patent: 4873757 (1989-10-01), Williams

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