Multi-layer printed circuit board wiring layout

Details Multi-layer printed circuit board wiring layout Multi-layer printed circuit board wiring layout

2007-04-17

2007-04-17

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257SE23021, C257SE23011, C257SE23067, C257S690000, C257S700000, C257S701000, C257S758000, C257S698000, C257S668000, C361S048000

Reexamination Certificate

active

11285334

ABSTRACT:
A multi-layer printed circuit board (PCB) includes a first wire layer, a middle layer above the first wire layer, a second wire layer above the middle layer, and a slanting via formed in the middle layer and the second wire layer. The manufacturing method includes the steps of providing a first wire layer and forming a first wiring on the first wire layer, forming a middle layer on the first wire layer, forming a second wire layer on the middle layer, forming a slanting via in the middle layer and the second wire layer wherein the direction of the slanting via is not orthogonal to the first and the second wire layers, forming a second wiring on the second wire layer by an etching method, and forming an electroplated layer in the via to connect the first wiring and the second wiring.

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