Multi-layer printed circuit board vacuum lamination method

Details Multi-layer printed circuit board vacuum lamination method Multi-layer printed circuit board vacuum lamination method

1985-04-15

1987-07-21

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156382, B32B 3120

Patent

active

046816496

ABSTRACT:
A method for laminating the layers of a printed circuit board book composed of printed circuit layers and adhesive layers, the method including loading the book between a pair of platens of a vacuum chamber, moving the platens together to a pre-specified distance apart, and allowing activation and curing of the adhesive layers at a pre-specified temperature and duration.

REFERENCES:
patent: 1887565 (1932-11-01), Sherts
patent: 3681167 (1972-08-01), Moore
patent: 3810815 (1974-05-01), Welhart et al.
patent: 3818823 (1974-06-01), Bond
patent: 4101364 (1978-07-01), Tsukada et al.
patent: 4127436 (1978-11-01), Friel
patent: 4328081 (1982-05-01), Fazlin
patent: 4425210 (1984-01-01), Fazlin
patent: 4474659 (1984-10-01), Fazlin

Affiliated with

Also associated with

Rating

Multi-layer printed circuit board vacuum lamination method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer printed circuit board vacuum lamination method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer printed circuit board vacuum lamination method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-205547