Multi-layer printed circuit board lamination apparatus

Details Multi-layer printed circuit board lamination apparatus Multi-layer printed circuit board lamination apparatus

1986-02-24

1987-08-25

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Chamber enclosing work during bonding and/or assembly

156285, B32B 3104

Patent

active

046891056

ABSTRACT:
A lamination apparatus is disclosed which includes serially interconnected loading vacuum chamber, press vacuum chamber and an unloading vacuum chamber. An input transport system is positioned within the loading chamber to transport a printed circuit board book therefrom into the press chamber. An output transport system is likewise positioned in the unloading chamber to remove the printed circuit board book from within the press chamber into the unloading chamber for unloading. The loading and unloading vacuum chambers isolate the press positioned within the press chamber from atmospheric pressure as the printed circuit board books sequentially flow through the lamination apparatus.

REFERENCES:
patent: 1887565 (1932-11-01), Sherts
patent: 2965527 (1960-12-01), Morris
patent: 3000346 (1961-09-01), Hnilicka
patent: 3272611 (1966-09-01), Jorgensen
patent: 3810815 (1974-05-01), Welhart et al.
patent: 4596624 (1986-06-01), Frohlich et al.

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