Multi-layer printed circuit board fabrication system and method

Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C382S145000, C382S294000, C348S087000, C438S007000

Reexamination Certificate

active

07058474

ABSTRACT:
A method for aligning an image to be recorded by a direct image scanner on an upper layer of a printed circuit board with an image recorded on a lower layer thereof, the method comprising:visually imaging a portion of the image on the lower layer; andrecording a pattern on the upper layer, referenced to coordinates of the visual image of the portion.

REFERENCES:
patent: 4566038 (1986-01-01), Dimick et al.
patent: 4680627 (1987-07-01), Sase et al.
patent: 4894790 (1990-01-01), Yotsuya et al.
patent: 5156772 (1992-10-01), Allan et al.
patent: 5161202 (1992-11-01), Kitakado et al.
patent: 5170058 (1992-12-01), Berasi et al.
patent: 5388517 (1995-02-01), Levien
patent: 5548372 (1996-08-01), Schroeder et al.
patent: 5643699 (1997-07-01), Waldner
patent: 5768443 (1998-06-01), Michael et al.
patent: 5856844 (1999-01-01), Batterman et al.
patent: 5980088 (1999-11-01), Iwasaki et al.
patent: 6064757 (2000-05-01), Beaty et al.
patent: 6165658 (2000-12-01), Taff et al.
patent: 6205364 (2001-03-01), Lichtenstein et al.
patent: 6246789 (2001-06-01), Hosotani et al.
patent: 6449516 (2002-09-01), Kyomasu et al.
patent: 6567713 (2003-05-01), Lichtenstein et al.
patent: 2002/0015165 (2002-02-01), Taka et al.
patent: WO 00/02424 (2000-01-01), None
IBM Technical Disclosure Bulletin; NN950689; Product Alignment Method for Probing Systems; 3 pages Jun. 1, 1995.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Multi-layer printed circuit board fabrication system and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-layer printed circuit board fabrication system and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-layer printed circuit board fabrication system and method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3690985

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.